News


 

April 10, 2008

Technologies and Devices International Inc. (TDI) joins Oxford Instruments plc

 

April 3, 2008

TDI announces production of 20-130 microns  thick   3-inch GaN epi products

 

January 10, 2008

TDI, Inc. announces Dr.V.Dmitriev’s passing

 

August 7, 2007

TDI, Inc. announces a product sale to mark the Company’s 10th anniversary!

 

August 2, 2007

TDI Celebrates 10 Year Anniversary

 

November 8, 2006

TDI adds 100 mm (4-inch) AlN-based semi insulating wafers to substrate production line

 

October 23, 2006

TDI Demonstrates Novel InGaN Epitaxial Materials at the International Workshop on Nitride Semiconductors (IWNS) 2006

 

October 17, 2006

TDI announces availability of Indium Nitride (InN) on sapphire samples

 

October 12, 2006

TDI demonstrates novel technology for GaN and AlGaN quantum wells and superlattices

 

June 2, 2006

TDI Fabricates the First 4-inch AlN-on-SiC Semi-Insulating Substrate for High Power Applications

 

August 22, 2005

TDI Demonstrates Indium Nitride Epitaxial Materials and Nano-Structures

 

August 15, 2005

TDI Releases Semi-Insulating Substrates for AlGaN/GaN HEMTs  

 

November 29, 2004
TDI Introduces Novel AlGaN Substrates for UV Semiconductor Emitters

October 26, 2004
TDI demonstrates 6-inch GaN epitaxy 

September 12, 2003
TDI Demonstrates One Square Centimeter SiC Diode Chip

February 25, 2003
TDI Releases New Semi-Insulating Substrates for GaN Devices

October 21, 2002
TDI Achieves Next Step in Gallium Nitride Substrate Materials with Sampling of  Thick P-type GaN Substrates

July 19, 2002
TDI Expands GaN Manufacturing to New 32,000 Sq. Ft. Facility in  Silver Spring, Maryland
 

October 16, 2001 
TDI Achieves Compound Semiconductor Breakthrough with 35mm True Bulk Gallium Nitride Substrate

 


 

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